Maximum operating frequency varies depending on track delays, master pad delays, and slave pad delays. Electrical Characteristics Table 6. For power up current see Section 3. The changes are listed in sequential page number order. The thermal environment can be controlled to change the case-to-ambient thermal resistance, R? All other product or service names are the property of their respective owners. Electrical Characteristics To avoid this condition, minimize the ramp time of the VDD supply to a time period less than

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Write code that avoids this condition. Electrical Characteristics Table 6.

y7fa Because the internal 1. For many natural convection and especially closed box applications, the board temperature at the perimeter edge of the package is approximately the same as the local air temperature near the device. JTAG timing specified at: Currents apply to output pins for the fast pads only and to input pins for the slow and medium pads only.

flasb Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from the junction.

To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization parameter? Effective size of the board which cools the component? Transitions within the limit do not affect device reliability or cause permanent damage.

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Specifications 5, 6, 7, and 8: The difference between the values determined for the single-layer 1s board compared to a four-layer board that has two signal layers, a power and a ground plane 2s2pdemonstrate that the effective thermal resistance is not a constant. Reset and Configuration Pin Timing This VDD33 lag specification applies during power up only. The changes are listed in sequential page number order. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.

Board temperature is measured on the top surface of the board near the package.

Freescale Semiconductor Evaluation Board for MPC5500 Series MPC5554EVBE MPC5554EVBE Data Sheet

In addition, the ambient temperature varies widely within the application. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur.

The thermal resistance depends on the: To avoid power-sequencing, VRC33 must be powered up within the specified operating range, even if the on-chip voltage regulator controller is not used. This fpash is specified at a maximum junction temperature of oC. When the clearance between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.

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The system integration unit SIU performs several chip-wide configuration functions. Electrical Characteristics To avoid this condition, minimize the ramp time of the VDD supply to a time period less than Changed the Revision number from 2 to 3.

Mechanicals 4 Mechanicals 4. The junction-to-case thermal resistance describes when using a heat sink or where a substantial amount of heat is dissipated from the top of the package. The value obtained on a board with the internal planes is usually within the normal range if the application board has: Vextal — Vxtal h7faa be? Each eTPU engine controls 32 hardware channels, providing a total of 64 hardware channels.

VSSA due to the presence of the sample amplifier. Electrical Characteristics Furthermore, when all of the PORs negate, the system clock starts to toggle, adding another large increase Unit Notes 7 tCIS F nominal bulk capacitor flaah than 4? F, and one 1?